jhbruhn 2020
stereo_mix v5
gib
/home/jhbruhn/Downloads/260322bfe49b091852bc7901a328687b.bmp
<B>Music Thing Modular parts library </b>
<ul>
<li>Components for Eurorack modular synths
</ul>
Eurorack Modular Synth 5 x 2 power header, fat pads and offset pins for easier soldering
POWER
GND
GND
GND
+
-
RED>RED
<h3>SparkFun Aesthetics</h3>
This library contiains non-functional items such as logos, build/ordering notes, frame blocks, etc.
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We've spent an enormous amount of time creating and checking these footprints and parts, but it is <b> the end user's responsibility</b> to ensure correctness and suitablity for a given componet or application.
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<br>If you enjoy using this library, please buy one of our products at <a href=" www.sparkfun.com">SparkFun.com</a>.
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<b>Licensing:</b> Creative Commons ShareAlike 4.0 International - https://creativecommons.org/licenses/by-sa/4.0/
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You are welcome to use this library for commercial purposes. For attribution, we ask that when you begin to sell your device using our footprint, you email us with a link to the product being sold. We want bragging rights that we helped (in a very small part) to create your 8th world wonder. We would like the opportunity to feature your device on our homepage.
<h3>Open-Source Hardware (OSHW) Logo - Small - Silkscreen</h3>
<p>Silkscreen logo for open-source hardware designs.</p>
<p>Devices using:
<ul><li>OSHW_LOGO</li></ul></p>
Open-Source Hardware (OSHW) Logo - Small - Silkscreen
Silkscreen logo for open-source hardware designs.
Devices using:
OSHW_LOGO
<B>Small Outline Narrow Plastic Gull Wing</B><p>
150-mil body, package type SL
>NAME
>VALUE
<b>Small Outline IC</b>
>NAME
>VALUE
<b>Small Outline IC</b>
>NAME
>VALUE
<B>DIODE</B>
>NAME
>VALUE
<b>CAPACITOR</b>
>NAME
>VALUE
<b>Chip RESISTOR 0402 EIA (1005 Metric)</b>
>NAME
>VALUE
Chip, 1.00 X 0.50 X 0.60 mm body
<p>Chip package with body size 1.00 X 0.50 X 0.60 mm</p>
Chip RESISTOR 0402 EIA (1005 Metric)
>NAME
>VALUE
>NAME
9mm vertical snap-in pot, Alpha / Panasonic style
>NAME
>VALUE
<h3>Plated Through Hole - 2x5 ARM Cortex Debug Connector (10-pin)</h3>
<p>tDoc (51) layer border represents maximum dimensions of plastic housing.</p>
<p>Specifications:
<ul><li>Pin count:10</li>
<li>Pin pitch:1.27mm</li>
</ul></p>
<p><a href=”http://portal.fciconnect.com/Comergent//fci/drawing/20021111.pdf”>Datasheet referenced for footprint</a></p>
<p>Example device(s):
<ul><li>CONN_05x2</li>
</ul></p>
>NAME
>VALUE
<b>OMRON SWITCH</b>
>NAME
<B>LED</B><p>
3 mm, round
>NAME
>VALUE
Plated Through Hole - 2x5 ARM Cortex Debug Connector (10-pin)
tDoc (51) layer border represents maximum dimensions of plastic housing.
Specifications:
Pin count:10
Pin pitch:1.27mm
Datasheet referenced for footprint
Example device(s):
CONN_05x2
>NAME
>VALUE
<b>Chip Capacitor Type KEMET A / EIA 3216-18 reflow solder</b><p>KEMET S / EIA 3216-12
>NAME
>VALUE
<b>CAPACITOR</b><p>
>NAME
>VALUE
<b>Chip RESISTOR 0402 EIA (1005 Metric)</b>
>NAME
>VALUE
<b>Diode</b>
>NAME
>VALUE
<b>CAPACITOR</b>
>NAME
>VALUE
Chip Capacitor Type KEMET A / EIA 3216-18 reflow solderKEMET S / EIA 3216-12
CAPACITOR
Chip RESISTOR 0402 EIA (1005 Metric)
Diode
Chip, 1.00 X 0.50 X 0.50 mm body
<p>Chip package with body size 1.00 X 0.50 X 0.50 mm</p>
<b>SMALL OUTLINE INTEGRATED CIRCUIT</b>
>NAME
>VALUE
<b>Small Outline Transistor 223</b><p>
PLASTIC PACKAGE CASE 318E-04<br>
Source: http://www.onsemi.co.jp .. LM137M-D.PDF
>NAME
>VALUE
direction of pcb
transportation for
wavesoldering
Small Outline Transistor 223
PLASTIC PACKAGE CASE 318E-04
Source: http://www.onsemi.co.jp .. LM137M-D.PDF
<b>JLCPCB design rules (2 layers)</b>
<ul>
<li>Board thickness: 1.6mm</li>
<li>Copper weight: 1oz (35um)</li>
<li>Note: annular ring aren't minimal</li>
</ul>
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.